News

PRECI-DIP’s Solderless Connectors for Military Jet Radars

Product 13 January 2025 Clement Reading time : 5 minutes
Share this article:

PRECI-DIP offers high-reliability connectors and interconnect solutions which are rigorously tested to withstand extreme conditions, meeting the demanding requirements of military, defense and aerospace applications. Our connectors are designed to ensure optimal performance and durability, even in the most challenging environments.

Durable solderless board-to-board connector solution

For radar systems in fighter jets, PRECI-DIP has developed a specialized board-to-board connector. Radar applications in avionics are highly demanding, with harsh environments where shock, vibration, and acceleration are common at 65,000 feet above sea level. In such conditions, reliability is paramount to ensure the safety and effectiveness of the aircraft’s systems.

In this board-to-board application, customers require a solderless solution with an extremely dense layout. This need leads to an interposer solution, which provides a reliable and efficient connection between circuit boards.

PRECI-DIP is a leader in fine-pitch interposer manufacturing and leverages its unique CLIP technology to offer the most reliable spring pins on the market. These spring pins are designed to maintain a secure connection even under extreme conditions, ensuring the continuous operation of critical systems.

256-Position Interposer Utilizing CLIP Technology

 

By utilizing advanced manufacturing techniques and rigorous testing protocols, PRECI-DIP ensures that our connectors meet the highest standards of quality and performance. This commitment to excellence coupled with our focus on innovation makes PRECI-DIP a trusted partner for next-generation defense applications, where reliability and precision are of utmost importance.

Share this article:

More news

March 12, 2025

PRECI-DIP at SATShow ’25

Learn more
March 10, 2025

PCB Connectors for Night Vision Goggles by PRECI-DIP

Learn more
March 6, 2025

PRECI-DIP at Electronica China 2025

Learn more