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[January 2010] ARROW CENTRAL EUROPE has been appointed as New Distributor Partner.
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[January 2010] New Sales and Marketing Director
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[November 2009] 74th China Electronics Fair
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[October 2009] PRECI-DIP SA is proud to announce that it has been JETRO Certified.
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[September 2009] 3rd Worldwide Distributors Days at Delémont
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DIL sockets


GENERAL SPECIFICATIONS: The values listed below are general specs applying for preci-dip DIL sockets. Please see individual catalog page for additional and product specific technical data.

Operating temperature range: -55 ... +125 °C
Climatic category (IEC): 55/125/21
Operating humidity range: annual mean 75 %
Max working voltage: 100 VRMS/150 VDC

Preci-dip sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

Mechanical characteristics
Clip retention Min. 40 N (no displacement under axial force applied)
Contact (sleeve / clip) retention Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2


Electrical characteristics
INSULATION RESISTANCE AT 500 V AC BETWEEN ANY TWO ADJACENT CONTACTS Min. 10'000 MΩ
CAPACITANCE BETWEEN ANY TWO ADJACENT CONTACTS Max. 1 pF
AIR AND CREEPAGE DISTANCES BETWEEN ANY TWO ADJACENT CONTACTS
(Min. 0.2 mm FOR SHRINK-DIP SOCKETS) 		Min. 0.6 mm


Environmental characteristics
The sockets withstand the following environmental tests without mechanical and electrical defects:
  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
  • Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-0020C, 260°C, 20 s
  • Moisture sensitivity J-STD-020C level 1
  • Resistance to corrosion:
    1. Salt spray test IEC 60068-2-11.Ka: 48 h
    2. Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
    3. Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH


Solderless compliant Press-Fit characteristics
Press-fit characteristics measured acc. to IEC 60352-5
  • Press-in force:
 90 N max. (at min. hole dia.) / 65 N typ.
  • Push-out force:
 30 N min. (at max. hole dia.) / 50 N typ.
  • Push-out 3rd cycle:
 20 N min. (at max. hole dia.)
 
PCB Hole Dimensions
  • 2.54 mm grid
 Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
 
PCB Hole Plating
PCB surface finish Hole plating
  • Tin
 5-15 µm tin over min. 25 µm copper
  • Copper
 min. 25 µm copper
  • Gold over nickel
 0.05-0.2 µm gold over 2.5-5 µm nickel
over min. 25 µm copper


Packaging
  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481. These products are marked with the symbol
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